发明名称 Precision device molding machine and method of molding by using it
摘要 The present invention provides a precision device molding machine and a molding method to make it possible for an adjustment of parallelism to be performed with a high degree of accuracy and excellent workability. The precision device molding machine includes a parallelism adjustment mechanism held by a supporting plate, a pressure applying plate that is movable up and down, a lower die disposed on the upper surface of the pressure applying plate and an upper die disposed on the parallelism adjustment mechanism. The parallelism adjustment mechanism includes a pressure receiving member, an adjusting plate, a transmitting member disposed between the pressure receiving member and the adjusting plate, a fixed fulcrum and an operating member. By having the operating member manipulated, the adjusting plate is moved, the pressure receiving member is slanted via the transmitting member with the fixed fulcrum acting as a pivot and the gradient of the pressure receiving member is adjusted, thereby allowing the parallelism between the upper die and the lower die to be adjusted and allowing a compound in a cavity formed with the molding die to be molded. Preferably, the adjusting plate has two adjusting plates and the respective adjusting plates are located on the apexes of a regular triangle and each respective adjusting plate has a slanting surface.
申请公布号 US2002015752(A1) 申请公布日期 2002.02.07
申请号 US20010842399 申请日期 2001.04.25
申请人 KAMOHARA KIYOTAKA;FUJII TAKEYUKI;KAITO HIROAKI 发明人 KAMOHARA KIYOTAKA;FUJII TAKEYUKI;KAITO HIROAKI
分类号 C03B11/16;B30B15/00;C03B11/08;(IPC1-7):B29C33/30 主分类号 C03B11/16
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