发明名称 |
METHOD AND APPARATUS FOR DETECTING POLISHING ENDPOINT WITH OPTICAL MONITORING |
摘要 |
An apparatus, as well as a method, brings a surface of a substrate into contact with a polishing pad that has a window, causes relative motion between the substrate and the polishing pad, and directs a light beam through the window so that the motion of the polishing pad relative to the substrate causes the light beam to move in a path across the substrate. An extreme intensity measurement is derived from a plurality of intensity measurements made as the light beam moves across the substrate. The beam sweeps across the substrate a plurality of times to generate a plurality of extreme intensity measurements, and a polishing endpoint is detected based on the plurality of extreme intensity measurements.
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申请公布号 |
US2002016066(A1) |
申请公布日期 |
2002.02.07 |
申请号 |
US19990460529 |
申请日期 |
1999.12.13 |
申请人 |
BIRANG MANOOCHER;SWEDEK BOGUSLAW;JOHANSSON NILS |
发明人 |
BIRANG MANOOCHER;SWEDEK BOGUSLAW;JOHANSSON NILS |
分类号 |
H01L21/66;B24B37/04;B24B49/04;B24B49/12;B24B57/02;H01L21/304;H01L21/321;(IPC1-7):H01L21/302;H01L21/00;H01L21/461 |
主分类号 |
H01L21/66 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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