METHOD FOR CUTTING OUT AT LEAST A THIN LAYER IN A SUBSTRATE OR INGOT, IN PARTICULAR MADE OF SEMICONDUCTOR MATERIAL(S)

摘要

The invention concerns a method for cutting out at least a thin layer in an element forming a substrate or an ingot for electronic or optoelectronic or optical component or sensor. The invention is characterised in that it comprises steps which consist in: forming in said element a embrittled zone having a thickness corresponding to that of the layer to be cut out; injecting into said element an energy pulse lasting not more than the duration required for a sound wave to pass through the thickness of the zone absorbing said pulse energy, said pulse having an energy selected to cause cleaving at said embrittled layer.