| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition capable of being utilized for an electronic circuit part and a substrate without generating the deterioration of molding property caused by a reduction of its flowing property, capable of transcribing a circuit pattern formed by a stamper in a good accuracy and capable of being extrusion molded. SOLUTION: This epoxy resin composition is characterized by using an epoxy resin, a curing agent, a curing accelerator and an inorganic filler as essential components, and containing 30-80 wt.% inorganic filler having <=10μm maximum particle diameter, <=3μm mean particle diameter and also 1.0-4.0 slope (n) of particle size distribution shown by a Rosin-Rammuler diagram (RRS), based on the total resin composition.
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