发明名称 HEATING APPARATUS
摘要 PROBLEM TO BE SOLVED: To effectively spread heat of high temperature gas over the whole of a radiator in a heating apparatus using the radiator. SOLUTION: A heating apparatus is adapted to include a radiator 12, where heat diffuses over the whole thereof through thermal conduction, and the thickness of a part to which heat of high-temperature gas is less likely to be directly conducted through thermal conduction is thicker than that of the other parts and a radiator heating air passage 15, through which high temperature gas is guided to a heat collection surface 13. Hereby, the heat diffuses over the whole of the radiator through thermal conduction. Since thickness of a part to which heat of high temperature gas is less likely to be conducted directly through thermal conduction is thicker than the other parts, the quantity of thermal conduction through that part is increased. Accordingly, heat of the high temperature gas spreads over the whole of the radiator and is effectively conducted to the radiator 12.
申请公布号 JP2002039548(A) 申请公布日期 2002.02.06
申请号 JP20000223400 申请日期 2000.07.25
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 YASUKI SEIICHI;OGINO TOSHIRO;KOMENO NORIYUKI;SHIGEOKA TAKEHIKO;KITAMURA MOTOHIKO;FUJITO TOSHIYA
分类号 F24C15/24;(IPC1-7):F24C15/24 主分类号 F24C15/24
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