| 摘要 |
PROBLEM TO BE SOLVED: To provide a plating apparatus which reduces an occupied area by efficiently arranging each unit (equipment) for carrying out plating and accompanied treatment continuously in one facility, and prevents a substrate from contamination by chemicals used in a plating process or the like, and a method. SOLUTION: This plating apparatus comprises, (1) accommodating a cassette stage 15 for mounting a cassette for housing a substrate, a pretreatment unit 21 for pretreating a surface of the substrate, and a plating unit 22 for plating the surface of the substrate pretreated in the pretreatment unit 21, in a facility 10, (2) arranging first substrate stages 23a and 23b for mounting the substrate, and a cleaning/drying equipment 16 for cleaning a plated substrate with pure water and drying, between this cassette stage 15 and the pretreatment unit 21, and (3) being provided with carrier devices 17 and 24 for transporting the substrate between each equipment in the facility 10. |
