发明名称 |
GRINDING METHOD OF GRINDING DEVICE |
摘要 |
The present invention relates to a polishing method using a grindstone comprising abrasive grains and a bonding resin for bonding the abrasive grains, as well as a polishing apparatus to be used for the polishing method. By using a resin for bonding abrasive grains it is possible to obtain a grindstone having a desired modulus of elasticity. With such a grindstone, the surface of a substrate having concave and convex portions can be rendered flat uniformly irrespective of the size of those concave and convex portions. Further, by first polishing the substrate surface with a polishing tool of a small elastic modulus and thereafter polishing it with a polishing tool of a large elastic modulus, it is possible to obtain a polished surface of reduced damage. The method of the invention is effective in planarizing various substrate surfaces having concave and convex portions. <IMAGE> |
申请公布号 |
EP0874390(A4) |
申请公布日期 |
2002.02.06 |
申请号 |
EP19950931398 |
申请日期 |
1995.09.13 |
申请人 |
HITACHI, LTD. |
发明人 |
MORIYAMA, SIGEO;YAMAGUCHI, KATSUHIKO;HONMA, YOSHIO;MATSUBARA, SUNAO;ISHIDA, YOSHIHIRO;KAWAAI, RYOUSEI |
分类号 |
B24B7/20;B24B27/00;B24B37/04;B24D3/00;B24D3/28;B24D3/34;B24D13/14;C08J5/14;H01L21/304;H01L21/3105 |
主分类号 |
B24B7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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