SPUTTERING TARGET MATERIAL

摘要

PROBLEM TO BE SOLVED: To provide a target material with a little generation of a particle. SOLUTION: The sputtering target material is characterized by consisting of titanium, by its sputtering face and side being acid etched, preferably by being used for a film forming of titanium nitride, and preferably by that the mean surface roughness is 0.01-3μm and its deviation on the sputtering face is 30% or less.