APPARATUS FOR MOLDING AND SEALING EMBOSSED CARRIER TAPE

摘要

PROBLEM TO BE SOLVED: To provide an apparatus for molding and sealing an embossed carrier tape wherein molding of the embossed carrier tape and encapsulation of an electronic component can be efficiently done. SOLUTION: The apparatus for molding and sealing the embossed carrier tape comprises a molding heating means 110 for heating to soften a molding, a molding means 130 for placing the heated molding in a metal mold 132 for embossing, a hole machining means 150 for forming guide holes at predetermined intervals on a side of a thermoplastic resin tape 10, a product insertion stage 210 for placing a product 20 in a recess 12 which has been embossed, a cover tape supply means 230 for supplying a cover tape 30 onto an upper surface of the embossed recess 12 of the tape 10, and a tape welding means 250 for welding the cover tape 30 with the tape 10 along a periphery of the recess 12 on a continuous carry path of the thermoplastic resin tape 10.