发明名称 NONWOVEN CLOTH FOR LAMINATE BOARD
摘要 PROBLEM TO BE SOLVED: To provide a nonwoven cloth for a laminated board useful for a print circuit board, an insulation board or the like requiring thermal resistance to soldering. SOLUTION: The nonwoven cloth for a laminated board comprises a fiber and a binder resin binding the fibers together where the binder resin comprises a main component which comprises o-cresol novolac type epoxy and a curing agent resin and a high molecular weight epoxypolyol resin having 1,000 to 100,000 molecular weight. The epoxypolyol resin is produced by introducing a reactive group with a glycidyl group, and the curing agent is a compound containing an active hydrogen.
申请公布号 JP2002037896(A) 申请公布日期 2002.02.06
申请号 JP20000228450 申请日期 2000.07.28
申请人 OJI PAPER CO LTD;ASAHI DENKA KOGYO KK 发明人 SHINOZUKA HIROSHI;FUJITA NAOHIRO
分类号 C08J5/06;C08J5/04;C08J5/24;D04H1/4218;D04H1/587;H05K1/03;(IPC1-7):C08J5/06;D04H1/58 主分类号 C08J5/06
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