发明名称 |
NONWOVEN CLOTH FOR LAMINATE BOARD |
摘要 |
PROBLEM TO BE SOLVED: To provide a nonwoven cloth for a laminated board useful for a print circuit board, an insulation board or the like requiring thermal resistance to soldering. SOLUTION: The nonwoven cloth for a laminated board comprises a fiber and a binder resin binding the fibers together where the binder resin comprises a main component which comprises o-cresol novolac type epoxy and a curing agent resin and a high molecular weight epoxypolyol resin having 1,000 to 100,000 molecular weight. The epoxypolyol resin is produced by introducing a reactive group with a glycidyl group, and the curing agent is a compound containing an active hydrogen.
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申请公布号 |
JP2002037896(A) |
申请公布日期 |
2002.02.06 |
申请号 |
JP20000228450 |
申请日期 |
2000.07.28 |
申请人 |
OJI PAPER CO LTD;ASAHI DENKA KOGYO KK |
发明人 |
SHINOZUKA HIROSHI;FUJITA NAOHIRO |
分类号 |
C08J5/06;C08J5/04;C08J5/24;D04H1/4218;D04H1/587;H05K1/03;(IPC1-7):C08J5/06;D04H1/58 |
主分类号 |
C08J5/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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