发明名称 |
COMPOSITE SUBSTRATE AND EL DEVICE COMPRISING THE SAME |
摘要 |
<p>The invention aims to provide a method for preparing a composite substrate of substrate/electrode/dielectric layer structure having a thick-film dielectric layer with a smooth surface using a sol-gel solution of high concentration capable of forming a film to a substantial thickness without generating cracks, the composite substrate and an EL device using the same. The object is attained by a method for preparing a composite substrate including in order an electrically insulating substrate, an electrode and an insulator layer formed thereon by a thick film technique, wherein a thin-film insulator layer is formed on the insulator layer by applying to the insulator layer a sol-gel solution obtained by dissolving a metal compound in a diol represented by OH(CH2)nOH as a solvent, followed by drying and firing; the composite substrate and an EL device using the same. <IMAGE></p> |
申请公布号 |
EP1178705(A1) |
申请公布日期 |
2002.02.06 |
申请号 |
EP20010902771 |
申请日期 |
2001.02.06 |
申请人 |
TDK CORPORATION |
发明人 |
TAKEISHI, TAKU;NAGANO, KATSUTO;TAKAYAMA, SUGURU;YANO, YOSHIHIKO |
分类号 |
H05B33/02;H05B33/10;H05B33/12;H05B33/22;(IPC1-7):H05B33/02 |
主分类号 |
H05B33/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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