发明名称 COMPOSITE SUBSTRATE AND EL DEVICE COMPRISING THE SAME
摘要 <p>The invention aims to provide a method for preparing a composite substrate of substrate/electrode/dielectric layer structure having a thick-film dielectric layer with a smooth surface using a sol-gel solution of high concentration capable of forming a film to a substantial thickness without generating cracks, the composite substrate and an EL device using the same. The object is attained by a method for preparing a composite substrate including in order an electrically insulating substrate, an electrode and an insulator layer formed thereon by a thick film technique, wherein a thin-film insulator layer is formed on the insulator layer by applying to the insulator layer a sol-gel solution obtained by dissolving a metal compound in a diol represented by OH(CH2)nOH as a solvent, followed by drying and firing; the composite substrate and an EL device using the same. &lt;IMAGE&gt;</p>
申请公布号 EP1178705(A1) 申请公布日期 2002.02.06
申请号 EP20010902771 申请日期 2001.02.06
申请人 TDK CORPORATION 发明人 TAKEISHI, TAKU;NAGANO, KATSUTO;TAKAYAMA, SUGURU;YANO, YOSHIHIKO
分类号 H05B33/02;H05B33/10;H05B33/12;H05B33/22;(IPC1-7):H05B33/02 主分类号 H05B33/02
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