| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition which contains a phosphorous- containing epoxy resin obtained by reacting an epoxy resin and a phosphorous compound, and a curing agent, and which can give a printed circuit board excellent in an insulating property, to provide a resin film and a prepreg using this epoxy resin composition, and furthermore provide a laminated sheet using at least one of these resin films and prepregs. SOLUTION: This epoxy resin composition which contains the phosphorous- containing epoxy resin obtained by reacting the epoxy resin and the phosphorous compound, and the curing agent, is characterized in that a content radio of the compound B in the phosphorous compound to a total of the phosphorous containing epoxy resin and the curing agent, expressed by formula (2), is below 100 wt.ppm.
|
