THERMOPLASTIC RESIN COMPOSITION, METHOD FOR MANUFACTURING THE SAME, AND SEMICONDUCTOR ELEMENT HOUSING PACKAGE

摘要

PROBLEM TO BE SOLVED: To provide a thermoplastic resin composition capable of producing resin moldings high in adhesion to a metal and low in water soaking. SOLUTION: The thermoplastic resin composition comprises (A) at least one thermoplastic resin having a melting point of 250 deg.C or higher selected from the group consisting of an aromatic polyamide resin, a liquid crystal polymer resin, and a styrene polymer having a structure which is mainly syndiotactic, (B) an olefin copolymer comprising anα-olefin and the glycidyl ester of anα,β-unsaturated acid, and (C) an inorganic filler. A thermoplastic resin composition having a structure like this produces nicely formed moldings excellent in adhesion to a metal and in moisture resistance.