INSULATING RESIN COMPOSITION FOR MULTILAYER PRINTED WIRING BOARD, MULTILAYER PRINTED WIRING BOARD USING THE SAME, AND PRODUCTION METHOD USING THE SAME

摘要

PROBLEM TO BE SOLVED: To obtain a multilayer printed wiring board which has high reliability and of which the insulation layer exhibits high heat resistance, high toughness, small heat distortion, and good adhesion to copper wiring. SOLUTION: A resin composition used contains a thermosetting resin, a thermoplastic resin, and a filler. A cured item obtained from the composition has a microphase separation structure. The filler is localized in either a thermosetting resin-rich phase or a thermoplastic resin-rich phase.