发明名称 PLATINUM PLATING SOLUTION AND PLATING METHOD THEREWITH
摘要 PROBLEM TO BE SOLVED: To provide a practical platinum plating bath which has neutral pH, is hardly decomposed at an anode side, can attain a high current efficiency and a high plating speed, and besides does not include sodium or potassium of an inhibition element. SOLUTION: The platinum plating bath includes an A component consisting of one or more kinds selected from the group consisting of diamminedenitroplatinum, hexahydroxoplatinum, hexaammineplatinum hydroxy salt, and hexachloroplatinate of water-soluble platinum salt, and a B component consisting of one or more kinds selected from the group consisting of glycin, iminodiacetic acid, and nitrilotriacetic acid.
申请公布号 JP2002038293(A) 申请公布日期 2002.02.06
申请号 JP20000223298 申请日期 2000.07.25
申请人 TANAKA KIKINZOKU KOGYO KK 发明人 OTANI YUTAKA
分类号 C25D3/50;C25D7/12;(IPC1-7):C25D3/50 主分类号 C25D3/50
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