GLASS FOR ENCAPSULATION OF SEMICONDUCTOR, EXTERNAL CYLINDER FOR SEMICONDUCTOR ENCAPSULATION AND METHOD OF ENCAPSULATION OF SEMICONDUCTOR ELEMENT

摘要

PROBLEM TO BE SOLVED: To provide glass for encapsulation of a semiconductor element which does not virtually contain hazardous contents like lead, etc., and yet permits sealing temperature of below 710 deg.C and jumette(?) and safe sealing. SOLUTION: The characteristics of the glass are that it does not virtually contain lead and has viscosity of 106 dPa.s at below 710 deg.C and contains more than two kinds of chemical elements out of Li2O, Na2O and K2O as well as B2O3 as essential elements.