| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and a device for wafer shape inspection which quantitatively evaluate the shape of a semiconductor wafer in three dimensions with high inspection precision. SOLUTION: The outer peripheral part of a silicon wafer W is sucked by a 2nd vacuum pump P2 to the stage surface of a vacuum chuck disk 11 and the silicon wafer W is temporarily fixed. Then fine unevenness appearing on the surface of the silicon wafer W, the wafer outer peripheral part shape, etc., are inspected. Thus, the wafer W is inspected while temporarily fixed to the stage surface, so the inspection is hardly affected by vibration propagated from the wafer shape inspecting device and the wafer W can be inspected in a free posture. Consequently, the shape of the wafer W can quantitatively be evaluated in three dimensions with high inspection precision. Further, the ordinary inspection of a wafer reverse surface standard can be performed.
|
