发明名称 |
APPARATUS FOR WET-ETCHING WAFER USED IN PROCESS FOR MANUFACTURING SEMICONDUCTOR |
摘要 |
PURPOSE: An apparatus for wet-etching a wafer used in a process for manufacturing a semiconductor is provided to eliminate etch ununiformity of the wafer generated by a density difference of a chemical solution, by rotating a pulsator to generate vortex and by solving a local density difference of the chemical solution. CONSTITUTION: An etch chamber(210) is charged with the chemical solution(C). An agitation unit agitates the chemical solution charged in the etch chamber to make the density of the chemical solution uniformly distributed in the etch chamber. The agitation unit includes the pulsator(220) installed on the bottom of the etch chamber and a pulsator driving unit(270) for rotating the pulsator in a predetermined direction.
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申请公布号 |
KR20020010741(A) |
申请公布日期 |
2002.02.06 |
申请号 |
KR20000044139 |
申请日期 |
2000.07.31 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
LEE, HYEON CHEOL |
分类号 |
H01L21/3063;(IPC1-7):H01L21/306 |
主分类号 |
H01L21/3063 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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