THICKNESS MEASURING APPARATUS OF SEMICONDUCTOR WAFER AND FLATNESS MEASURING APPARATUS OF SEMICONDUCTOR WAFER

摘要

PROBLEM TO BE SOLVED: To accurately judge quality of thickness and flatness of a wafer. SOLUTION: Thickness of a wafer 3 to be measured is measured by using probes 1, 2 while the surface of the wafer 3 is irradiated with a light of a halogen lamp 4 which has energy of at least band gap of material constituting the wafer 3.