| 摘要 |
PROBLEM TO BE SOLVED: To provide a solvent or alkali, developable negative or positive-type photosensitive resin composition which forms a polyimide film on a substrate (a silicon wafer or the like), in such a way that the substrate ensures low residual stress and can form a satisfactory pattern, to provide a method for producing a pattern by which a pattern having high sensitivity, high resolution and a proper shape is produced by i-line exposure and a polyimide film having low stress after imidation and superior in heat resistance can be formed, and to provide electronic components of superior reliability. SOLUTION: The photosensitive resin composition contains (a) a polyimide precursor, having a degree of light transmittance which to inhibit a photoreaction and ensuring <=2×10-5/K coefficient of thermal expansion at below the glass transition temperature after imidation and (b) a polyimide precursor having such a degree of light transmittance as not to inhibit a photoreaction, having <350 deg.C glass transition temperature after imidation and ensuring <=2×10-4/K coefficient of thermal expansion at below the glass transition temperature after imidation. |
