| 摘要 |
PROBLEM TO BE SOLVED: To provide a photo-curing resin composition, capable of giving high performance cured film of superior moisture and heat and resistances, adhesion, mechanical and electrical characteristics and suitable for use in the production of a printed wiring board, a high density multilayer sheet, a semiconductor package, etc., and to provide a photosensitive element obtained by disposing a layer of the photo-curing resin composition on a base and giving a cured film having superior moisture and heat resistances, adhesion, mechanical characteristics and electrical insulating property. SOLUTION: The photo-curing resin composition contains an acid modified vinyl-containing epoxy resin (A), an elastomer (B), a photopolymerization initiator (C), a diluent (D) and a curing agent (E) as essential components. The elastic modulus of a cured film of the composition in the measurement of dynamic viscoelasticity in the range of 200-220 deg.C is 1-100 MPa. |
