| 发明名称 |
Method of forming chromium coated copper for printed circuit boards |
| 摘要 |
<p>A sheet material, comprised of a copper foil treated to have a stabilization layer thereon. The stabilization layer is comprised of zinc oxide, chromium oxide or a combination thereof having a thickness between about 5 ANGSTROM and about 70 ANGSTROM . A vapor deposited resistive material is provided on the stabilization layer. <IMAGE></p> |
| 申请公布号 |
EP1178128(A1) |
申请公布日期 |
2002.02.06 |
| 申请号 |
EP20010202674 |
申请日期 |
2001.07.12 |
| 申请人 |
GA-TEK, INC. (DBA GOULD ELECTRONICS, INC.) |
发明人 |
WANG, JIANGTAO;CALLAHAN, JOHN;LILLIE, DAN |
| 分类号 |
C25D11/38;C23C2/02;C23C2/26;C23C14/02;C23C14/06;C23C14/08;C23C14/14;C23C14/24;C23C16/06;C23C22/24;C23C22/82;C23C28/00;C23C28/04;C25D5/48;C25D7/00;C25D9/08;H05K1/09;H05K1/16;H05K3/00;H05K3/24;H05K3/38;(IPC1-7):C23C14/02;H05K3/16;H05K3/14 |
主分类号 |
C25D11/38 |
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