| 摘要 |
PURPOSE: A semiconductor device and a fabricating method thereof are to provide a printed circuit board(PCB) pattern type and its structure by using a PCB instead of a leadframe which used to be packaged after a semiconductor chip is mounted on the leadframe. CONSTITUTION: A plating path of a quadrangular type is formed in the PCB(20) so that liquid copper flows toward the rear surface of the PCB to form a copper film pattern of a predetermined type when a copper film is formed on the PCB. The liquid copper flows toward the front surface of the PCB to form a copper film on the front surface while a copper film of a predetermined type is formed on the rear surface of the PCB by making the liquid copper flow through the plating path. Dies and lead patterns(22) of the PCB are so formed that the semiconductor chip(23) can be mounted on the PCB having the copper film of a predetermined type and is bonded to the PCB. A PCB pattern is so formed on the PCB having the copper film of a predetermined type that the semiconductor chip can be mounted. Circular holes(29) are formed in predetermined portions of the respective copper patterns on the PCB.
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