METHOD FOR ALIGNING WAFER IN EXPOSURE PROCESS

摘要

PURPOSE: A method for aligning a wafer in an exposure process is provided to improve productivity, by performing the exposure process of the wafer while not performing a rework when a defective fine alignment occurs. CONSTITUTION: A fine alignment process is performed to align the semiconductor wafer having a coated photoresist layer with a precise position. When the fine alignment of the wafer is not performed, the position of the wafer is manually corrected and the corrected position data is feedback. The fine alignment process is performed again. An exposure process is performed regarding the aligned wafer. The initial position data value of the fine alignment is corrected based upon the manually-corrected position data.