发明名称 |
Stacked semiconductor package with flexible tape |
摘要 |
A stacked semiconductor package is formed by forming a semiconductor wafer having a plurality of semiconductor chips with chip pads on their upper sides, where the chips are arranged in pairs; sawing the wafer along edges of the semiconductor chips; adhering a bonding tape to adjacent pairs of the semiconductor chips, wherein conductive interconnections on the bonding tape electrically couple corresponding chip pads of adjacent chips; cutting the bonding tape so that only adjacent pairs of the chips remain attached to one another; and stacking the adjacent pairs of semiconductor chips so that the upper sides of the chips are substantially parallel. The method may include an additional step of adhering a plurality of solder balls on the bonding tape to serve as external leads of the package. Further, the adjacent pairs of semiconductor chips may be attached to opposite sides of a heat conducting plate which serves to dissipate heat generated by the chips. |
申请公布号 |
US6344683(B1) |
申请公布日期 |
2002.02.05 |
申请号 |
US19990393184 |
申请日期 |
1999.09.10 |
申请人 |
HYUNDAI ELECTRONICS INDUSTRIES CO., LTD. |
发明人 |
KIM SUN-DONG |
分类号 |
H01L23/48;H01L23/538;H01L25/065;(IPC1-7):H01L21/48 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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