发明名称 Integrated radiation emitting system and process for fabricating same
摘要 High quality epitaxial layers of compound semiconductor materials can be grown overlying large silicon wafers by first growing an accommodating buffer layer on a silicon wafer. The accommodating buffer layer is a layer of monocrystalline oxide spaced apart from the silicon wafer by an amorphous interface layer of silicon oxide. The amorphous interface layer dissipates strain and permits the growth of a high quality monocrystalline oxide accommodating buffer layer. Any lattice mismatch between the accommodating buffer layer and the underlying silicon substrate is taken care of by the amorphous interface layer. Radiation systems, including radiation sources such as light emitting diode or lasers and wave guides may be formed in the high quality epitaxial compound semiconductor material and above the oxide layers.
申请公布号 AU7696401(A) 申请公布日期 2002.02.05
申请号 AU20010076964 申请日期 2001.07.18
申请人 MOTOROLA, INC. 发明人 BARBARA M. FOLEY;WILLIAM JAY OOMS;JAMES E. PRENDERGAST;KURT EISENBEISER;JAMAL RAMDANI;RAVINDRANATH DROOPAD
分类号 H01L21/20;H01L33/00;H01L33/30;H01S5/02;H01S5/026;H01S5/183;H01S5/32 主分类号 H01L21/20
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