发明名称 Modular machine for polishing and planing substrates
摘要 The invention concerns a polishing machine comprising at least a base unit (10) in the form of a parallelepiped cell (12), with a first loading and unloading surface (14), a second opposite parallel surface (16) for access to the working zone located in an intermediate section (24), and third and fourth surfaces (18, 20). The loading pallet board (48) and unloading pallet board (56) are respectively borne by a loading arm (50) and an unloading arm (58) operating independently of each other, said pallet boards being both accessible on the first surface (14) side. The mechanism (28, 30) is located in the lower section beneath the cell (12) intermediate section (24), while the automaton is arranged in the top section, the mechanism and the automaton being accessible on the second surface (16) side.
申请公布号 US6343979(B1) 申请公布日期 2002.02.05
申请号 US20000646956 申请日期 2000.09.25
申请人 PELTIER MARC;GRISEL LUCIEN 发明人 PELTIER MARC;GRISEL LUCIEN
分类号 B23Q39/04;B24B37/04;B24B37/34;B24B41/02;B24B53/007;B24B53/017;H01L21/304;(IPC1-7):B24B29/00 主分类号 B23Q39/04
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