发明名称 COMPOSITION FOR METAL BONDING
摘要 PROBLEM TO BE SOLVED: To provide a composition for metal bonding capable of removing an oxidized film on a surface of base metal and bonding metals to each other. SOLUTION: A composition for metal bonding is composed of metal particles and a hydrocarbon compound which C-H bonding and dissociation energy is below 950 KJ/mol. When heating up with the composition for metal bonding between metals to be bonded, the hydrocarbon compound forms a radical state in which hydrogen is separated and deoxidizes the oxidized film of the metal surface to be bonded. Therefore, metals are bonded in good condition through the intermidiary of the metal particles.
申请公布号 JP2002035987(A) 申请公布日期 2002.02.05
申请号 JP20000235264 申请日期 2000.07.31
申请人 DENSO CORP 发明人 MIYAKE TOSHIHIRO;YAZAKI YOSHITARO
分类号 B23K35/22;B23K35/363;H05K3/36;(IPC1-7):B23K35/22 主分类号 B23K35/22
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