Methods of processing semiconductor wafers, methods of supporting a plurality of semiconductor wafers, methods of processing electronic device workpieces and methods of orienting electronic device workpieces

摘要

An aspect of the present invention provides a method of processing electronic device workpieces, individual electronic device workpieces having a front surface and a back surface, the method includes providing an electronic device workpiece carrier including a plurality of workpiece receivers; positioning individual electronic device workpieces within the workpiece receivers, the positioning orienting the front surface of one electronic device workpiece to face the front surface of a first immediately adjacent electronic device workpiece and orienting the back surface of the one electronic device workpiece to face the back surface of a second immediately adjacent electronic device workpiece; and positioning the electronic device workpiece carrier within an electronic device workpiece processor and processing the electronic device workpieces with the electronic device workpieces so oriented.