POLISHING SURFACE TEMPERATURE CONDITIONING SYSTEM FOR CHEMICAL MECHANICAL PLANARIZATION PROCESS

摘要

PURPOSE: A polishing surface temperature conditioning system is provided to reduce cost for changing a polishing surface, or leaving the machine idle and cost for the labor and production polishing downtime. CONSTITUTION: The polishing surface temperature conditioning apparatus comprises a fluid delivery system that is coupled to the polishing system and that is configured to deliver a fluid to a polishing surface of a polishing surface. The system further includes a heat exchanger that is coupled to the fluid delivery system and that is configured to control a fluid temperature of the fluid. The fluid temperature is chosen to effect a surface temperature of the polishing surface.