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发明名称
METHOD FOR REMOVING DEFECTS FROM SILICON BODIES BY A SELECTIVE ETCHING PROCESS
摘要
申请公布号
KR20020010441(A)
申请公布日期
2002.02.04
申请号
KR1020007014856
申请日期
2000.12.27
申请人
发明人
分类号
H01L21/30
主分类号
H01L21/30
代理机构
代理人
主权项
地址
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