| 摘要 |
PURPOSE: An epoxy resin composition for sealing a semiconductor device is provided, to improve the cracking resistance at a high temperature and the adhesive strength to a lead frame or a print circuit board and to reduce the heat deformation. CONSTITUTION: The composition comprises 3.5-7.0 wt% of a naphthalene-based epoxy resin represented by the formula 2; 3.5-7.0 wt% of a novolac-based curing agent; 0.1-0.3 wt% of a curing promoter; and 85-92 wt% of an inorganic filler, wherein R is H or methyl group. Preferably the novolac-based curing agent is at least one selected from the group consisting of common phenol novolac resin, xyloc resin, dicyclopentadiene resin which contain two or more of OH groups and have a OH equivalent of 100-200. The curing promoter is at least one selected from the group consisting of a tertiary amine; an imidazole; an organic phosphine; and a tetraphenyl boron salt. The inorganic filler is a fused or synthetic silica with a mean particle size of 0.1-35.0 micrometers, and preferably comprises powdered silica and spherical silica in a ratio of 3:7-0:10. |
