SYSTEM FOR PROCESSING SEMICONDUCTOR SUBSTRATE

摘要

PURPOSE: A system for processing a semiconductor substrate is provided to eliminate the need for a position control unit for centering a wafer, by making a transfer robot reciprocate between a process unit for processing the wafer and a cassette receiving the wafer before and after the wafer is processed by the process unit. CONSTITUTION: A plurality of semiconductor substrates are received in at least one cassette(200a,200b). A plurality of process units(300a,300b,300c,300d) process the plurality of semiconductor substrates received in the cassette. The transfer robot(100) reciprocates between the cassette and the plurality of process units, directly transferring the semiconductor substrate.