发明名称 APPARATUS FOR TESTING ELECTRONIC COMPONENTS AND METHOD THEREOF
摘要 PURPOSE: An apparatus for testing electronic components is provided to test a lead of electronic components and a ball error by using Moire interference pattern. CONSTITUTION: An apparatus for testing electronic components(36) includes a lamp(32), a projection grid, a projection lens(34), a focusing lens(38), a reference grid, CCD camera(40), and a signal processor. The projection grid forms an image of a projection grid by using the light of the lamp(32). The projection lens(34) projects the image of the projection grid on a surface of the electronic components(36), and forms a projection grid pattern image on the surface of the electronic components(36). A focusing lens(38) forms a projection grid pattern image. The reference grid forms Moire pattern by an interference of the projection grid image. The CCD camera(40) picks up the Moire pattern. The signal processor forms three dimensional image by signal-processing the picked-up Moire pattern of the CCD camera.
申请公布号 KR20020009207(A) 申请公布日期 2002.02.01
申请号 KR20000042746 申请日期 2000.07.25
申请人 SAMSUNG TECHWIN CO., LTD. 发明人 KIM, SANG CHEOL
分类号 H05K13/08;(IPC1-7):H05K13/08 主分类号 H05K13/08
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