| 摘要 |
PURPOSE: A method for fabricating a thin type semiconductor package is provided to reduce a fabricating cost by forming the semiconductor package without using a particular kind of lead frame and simplify a fabrication process by performing a junction process once. CONSTITUTION: A die(23) is adhered to a substrate. A gold wire is formed between an aluminium pad and the die(23) formed on the substrate. A semiconductor chip, the gold wire and the substrate are molded by using a synthetic resin. The residues except for a circuit layout are removed from the substrate by performing an etch process for the substrate. The substrate is cut according to a desired size of semiconductor package. |
