发明名称 HOUSING PACKAGE FOR SOLID-STATE IMAGE PICKUP ELEMENT AND SOLID-STATE IMAGE PICKUP DEVICE
摘要 PURPOSE: To provide a solid-state image pickup element housing package 1 containing a solid-state image pickup element 12 of the same size that is miniaturized resulting in miniaturizing a solid-state image pickup device containing the solid-state image pickup element 12 and in miniaturizing a unit, a video camera or a still camera or the like employing the solid-state image pickup device. CONSTITUTION: Positioning holes 3, 4 and mount holes 5, 6 of the solid-state image pickup element housing package 11 whose flat shape is nearly rectangular where the positioning holes 3, 4 and mount holes 5, 6 are respectively provided to both sides of a solid-state image pickup element housing recessed part 2 are arranged in a positional relation in which a line l34 tying the centers of the positioning holes 3, 4 and a line l56 tying the centers of the mount holes 5, 6 are in crossing at the center (o) of the solid-state image pickup element housing package 11.
申请公布号 KR20020009475(A) 申请公布日期 2002.02.01
申请号 KR20010044369 申请日期 2001.07.24
申请人 SONY CORPORATION 发明人 SEKIMOTO EMIKO
分类号 H01L27/14;H01L23/02;H01L23/04;H01L23/057;H01L25/00;H01L27/146;H04N5/335;H04N5/372;H04N5/374;(IPC1-7):H01L25/00 主分类号 H01L27/14
代理机构 代理人
主权项
地址