发明名称 TRANSPARENT CONDUCTIVE SUBSTRATE AND MANUFACTURING METHOD AND EMBROCATION FOR FORMING TRANSPARENT COAT LAYER USED IN THE MANUFACTURING METHOD AND DISPLAY DEVICE WHICH TRANSPARENT CONDUCTIVE SUBSTRATE IS APPLIED FOR
摘要 <p>PURPOSE: To provide a transparent conductive substrate and the manufacturing method, which has functions of static elimination or an shield of an electric field and antireflection, and is superior in scratch strength of a transparent two-layer film, and is capable of reducing costs of manufacture, and to provide an embrocation for forming a transparent coat used in the manufacturing method, and a display device which the transparent conductive substrate is applied for. CONSTITUTION: The transparent conductive substrate is provided with the transparent substrate, and the transparent two-layer film consisting of the transparent conductive layer and the transparent coat layer which are sequentially formed on the transparent substrate. The transparent conductive layer contains conductive fine particles of 1-100 nm mean diameter and a binder matrix of silicon oxide as the main component. The transparent coat layer contains the binder matrix of the silicon oxide including one or more kinds of alkyl groups selected from 7-30C long-chain alkyl groups as the main component.</p>
申请公布号 KR20020009509(A) 申请公布日期 2002.02.01
申请号 KR20010044836 申请日期 2001.07.25
申请人 SUMITOMO METAL MINING CO., LTD. 发明人 TOFUKU ATSUSHI;YUKINOBU MASAYA
分类号 H05B33/28;B32B7/02;B32B17/06;B32B27/18;C03C17/34;C03C17/36;C09C1/00;C09C1/62;C09C3/06;C09D5/24;C09D7/12;C09D183/00;H01B1/20;H01B1/22;H01B5/00;H01B5/14;H01J29/88;(IPC1-7):H01J29/88 主分类号 H05B33/28
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