| 摘要 |
PROBLEM TO BE SOLVED: To provide a function device unit which can be improved in reliability and performance and its manufacturing method. SOLUTION: A recessed part 12 is formed on the top surface of a silicon substrate 11, and a wiring layer 13 which extends from the bottom surface of the recessed part 12 to the top surface through the side is formed to obtain a base 10 for mounting. A semiconductor chip 14 is flip-chip mounted on this base 10. |
