PHOTOSENSITIVE SOLDERING RESIST LAYER, WIRING BOARD USING THE SAME AND ELECTRONIC PARTS MODULE

摘要

PROBLEM TO BE SOLVED: To provide a photosensitive soldering resist layer excellent in heat and moisture resistances and free of ion migration in a high acceleration test (HAST) even when the soldering resist layer is made thin and to provide a wiring board using the soldering resist layer and an electronic parts module. SOLUTION: The photosensitive soldering resist layer comprises a photosensitive resin composition, a chelate polymer which captures impurity ions in the composition, an elastomer which imparts flexibility and an inorganic insulating filler having 0.1-2 μm average particle diameter and has >=1010 Ω insulation resistance after it is allowed to stand in an environment at 85 deg.C and 85% relative humidity for 168 hr. Since the chelate polymer which captures impurity ions is contained, the soldering resist layer has good moisture resistance.