CHEMICAL TREATMENT DEVICE, AND CHEMICAL TREATMENT METHOD USING THE SAME

摘要

PROBLEM TO BE SOLVED: To reduce the overall piping length in a plating device with a plurality of plating units disposed in series. SOLUTION: A plating solution tank 61 is installed in each external treatment tank 42 of a plurality of plating units 41. The plating solution 62 in each plating solution tank 61 is ejected in each inner treatment tank 43 via each feed pipe 64 by the drive of each pump 66, and fed onto a surface of a tape 53 passing through each inner treatment tank 43. Most of the plating solution 62 ejected in each inner treatment tank 43 is recovered in each plating solution tank 61 via inner drain pipes 77 and 78. A part of the plating solution 62 ejected in each inner treatment tank 43 flows out of slits 47 and 48 into each external treatment tank 42, and recovered into each plating solution tank 61 via external drain pipes 73 and 74.