| 摘要 |
PROBLEM TO BE SOLVED: To provide a dispersive plating method capable of realizing the uniform eutectic of the dispersant of sufficient amount in order to give the function in a plating film, having high rate of utilization of the dispersant and high plating speed, and capable of controlling the eutectic ratio of the dispersant and the eutectic mode of the dispersant particles. SOLUTION: In the dispersive plating method comprising a first step of installing a work 2 and a facing electrode 3 in a plating solution, a second step of bringing the dispersant for the eutectic in the plating film into contact with the work 2, and a third step of realizing the precipitation of the plating metal and the eutectic of the dispersant by running the direct current from an external power supply 5 so that the work 2 forms a cathode and the facing electrode 3 forms an anode, the plating is implemented by applying the magnetic field so as to generate the line of magnetic force parallel to the direction of the current running in the plating solution 1.
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