Verfahren zur Anbringung von elektronischen Bauelementen auf Leiterplatten

摘要

Anisotropic conductive material is employed instead of solder for connecting between the terminal of a component and a printed circuit board. In addition to the printed circuit board, a printed circuit sheet is provided and the terminal of the component is sandwiched between both anisotropic materials on the printed circuit board and beneath the printed circuit sheet. From both outside surfaces of the printed circuit board and the sheet, heat and pressure are simultaneously applied to the terminal part (i.e. thermocompression bonding).