| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an inspection pad for inspecting an IC chip, and to realize a smaller IC chip. SOLUTION: IC chip 2 is isolated, and on a scribe line 3 which is later cut, an inspection pad 4 electrically connected to an internal circuit of the IC chip 2 is formed. The inspection pad 4 is used for inspecting the behavior of the IC chip 2 in an inspection process, and is cut off together with the scribe line 3 in a cut process.</p> |
