发明名称 WIRING BOARD
摘要 <p>PROBLEM TO BE SOLVED: To provide a wiring board which can prevent troubles, such as electrical contact defects, leaks, due to moisture and is required to be improved further, by preventing moisture from penetrating into the wiring board through its outer circumference. SOLUTION: This wiring board 1 has a part 6, through which moisture is drained out and which is formed on at least one of an upper surface 3 and a lower surface 4 of its outer circumferential rib 5. The part 6, through which moisture is drained out, is constituted so as to be at least formed of a large number of minute protrusions 6a.</p>
申请公布号 JP2002034130(A) 申请公布日期 2002.01.31
申请号 JP20000210042 申请日期 2000.07.11
申请人 YAZAKI CORP 发明人 IKEHATA TAKAYUKI
分类号 H01R13/52;H02G3/16;(IPC1-7):H02G3/16 主分类号 H01R13/52
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