Heat sink-type cooling device

摘要

A heat sink-type cooling device is provided which can enhance the amount of heat dissipated without increasing the size of the fins, and which is miniaturized and has high cooling capacity. A heat sink-type cooling device comprises a heat sink that is provided with a passage through which coolant flows, and that removes heat from electronic devices contacting with the upper surface of the heat sink. Fin groups are provided in the passage, each of which is comprised of a plurality of fins that are disposed in parallel with the direction of the coolant flow and are aligned in the thickness direction thereof. Fins of a fin group and other fins of another fin group adjoining the fin group in the direction of the flow are placed at a distance in the thickness direction of the fins.