AN INTEGRATED CIRCUIT PACKAGE AND A METHOD MANUFACTURING THE SAME

摘要

PURPOSE: An integrated circuit package and a method manufacturing the same are provided to improve electrical performance by using an intergated circuit chip. CONSTITUTION: An integrated circuit package has a board including a hollow with a low conductive level exposed in the package and hence a connection can be formed between an integrated circuit chip and an underlying conductive level to reduce the number of through-holes formed in the board. As the result, added signal line interconnections can be contained in a board circuit package and/or the integrated circuit chip can be made compact, thereby improving the electric performance. For a board containing a plurality of bonding hierarchical layers, the wire-to-wire length is long and hence a wire bonding process and a later sealing process can be made easily.