Verfahren zum Verkappen eines Chipkartenmoduls,申请号DE19955009954-传众专利搜索

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发明名称	Verfahren zum Verkappen eines Chipkartenmoduls
摘要
申请公布号	DE59509954(D1)	申请公布日期	2002.01.31
申请号	DE19955009954	申请日期	1995.01.16
申请人	ODS LANDIS & GYR GMBH & CO. KG	发明人	SCHMIDT, FRANK-THOMAS;SCHANDOCK, DIETER
分类号	G06K19/077;(IPC1-7):G06K19/077	主分类号	G06K19/077
代理机构		代理人
主权项
地址

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