| 摘要 |
PROBLEM TO BE SOLVED: To provide an inspection method, together with a device using it for shortening the time required for inspecting a wire after bonding, with improved inspection precision. SOLUTION: A stitch, which is a joint end part of a wire to a lead as well as its vicinity are imaged, related to a plurality of wires bonded for connection between an electrode pad on a semiconductor chip side and a lead of a lead frame, arranged around a chip. The acquired image data is analyzed for sequential inspection. Here, at analyzing the image data acquired corresponding to the wires, a threshold value of image density for discriminating the stitch is automatically calculated. |
