发明名称 CIRCUIT BOARD FOR SURFACE EMITTING ELEMENT MODULE
摘要 PROBLEM TO BE SOLVED: To provide a circuit board for a surface emitting element module where shorting between wires which connect an electrode of a surface emitting element to a wiring pattern is surely prevented. SOLUTION: A pattern of an electrode of a surface emitting element which is mounted face up and a plurality of wiring patterns connected to it by wire bonding is so designed that no wire connected to a positive-pole side electrode in all surface emitting elements crosses a wire connected to a negative-pole side electrode nor mounting directions of both wires are identical.
申请公布号 JP2002033522(A) 申请公布日期 2002.01.31
申请号 JP20000214313 申请日期 2000.07.14
申请人 MITSUBISHI CABLE IND LTD 发明人 SANO SHINICHI;MATSUDA HIDEAKI
分类号 B29C45/14;H01L21/56;H01L21/60;H01L23/12;H01L33/32;H01L33/56;H01L33/58;H01L33/62 主分类号 B29C45/14
代理机构 代理人
主权项
地址