发明名称 |
CIRCUIT BOARD FOR SURFACE EMITTING ELEMENT MODULE |
摘要 |
PROBLEM TO BE SOLVED: To provide a circuit board for a surface emitting element module where shorting between wires which connect an electrode of a surface emitting element to a wiring pattern is surely prevented. SOLUTION: A pattern of an electrode of a surface emitting element which is mounted face up and a plurality of wiring patterns connected to it by wire bonding is so designed that no wire connected to a positive-pole side electrode in all surface emitting elements crosses a wire connected to a negative-pole side electrode nor mounting directions of both wires are identical. |
申请公布号 |
JP2002033522(A) |
申请公布日期 |
2002.01.31 |
申请号 |
JP20000214313 |
申请日期 |
2000.07.14 |
申请人 |
MITSUBISHI CABLE IND LTD |
发明人 |
SANO SHINICHI;MATSUDA HIDEAKI |
分类号 |
B29C45/14;H01L21/56;H01L21/60;H01L23/12;H01L33/32;H01L33/56;H01L33/58;H01L33/62 |
主分类号 |
B29C45/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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