| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method for mounting a semiconductor chip by which work time can be shortened at mounting the semiconductor chip. SOLUTION: A wafer 23 loaded with a conductive bump 19 is installed to a work stage 39. To the surface of the wafer 23, an underfill material film 29 stuck to the surface of a thin film member 28 is pressed. At this time, the underfill material film 29 is softened. The conductive bump 19 is passed through the underfill material film 29. After the underfill material film 29 is hardened, a thin-film member 28 is peeled off from the underfill material film 29. In this a manner, an underfill material is supplied simultaneously to the respective semiconductor chips included in the wafer 23. Thus, compared to the case of individually supplying the underfill material to each semiconductor chip, the work time is shortened markedly.</p> |
